9:30-16:30
一. Theory of adhesives
二. Design concept of synthesis and formulation for adhesives- Acrylates, Epoxy, Polyurethane, Silicone and Styrene- butadiene copolymers
三. Acrylic resins based adhesives and applications
i. PSA for protective film and polarizer
ii. Sealant for display (UV+ thermal, UV+ moisture)
iii. Optical clear adhesives- liquid and film type, Thermal and UV curing, dual cure type
iv. UV/ thermal debonding tape
v. Aqueous PSA
vi. Bonding sheet for flexible Printed circuit
vii. IR cut PSA for car window
viii. Solvent free UV curable adhesives
林顯光
工研院材化所 技術長
學歷：
國立清華大學化工系博士
國立成功大學化工所碩士及化工系學士
經歷：
工研院材化所
技術長、光電有機材料研究組組長、副組長、經理、正研究員、研究員、副研究員
四. Epoxy resin based adhesives and applications
i. BT resins for IC carriers
ii. Ajinomoto build-up film (ABF)
iii. Resin-coated copper (RCC)
iv. Epoxy adhesives for Silicon Photonics
五. Polyurethane based adhesives and applications
i. TPU film and PU adhesives for airship
六. SBR based adhesives and applications
i. Biomass based wood adhesives
七. Adhesives from Silicone resins
i. Adhesives for staples
八. Holt melt adhesives
研究領域：
PCB/IC carrier用光阻/防焊材料、Color resist for LCD、Alignment layer for LCD、生質熱熔膠、光學感壓膠（觸控面板OCA, 偏光膜PSA）、全水性感壓膠、面板用高及低折射率材料、奈米壓印材料、微米級PMMA球、超薄型偏光膜、UV硬化LED封裝材料、PEDOT透明導電高分子合成及塗料、AMOLED材料及元件結構設計、Dicing tape and Grinding tape for IC/ LED、車用材料:IR cutting film、Adhesives for window film、Paint protective film、3D printing材料、Non-added formaldehyde adhesives for plywood、Bio-mass materials for electronics、Micro LED巨量轉移材料、鋰電池電極材料、Materials for Airship、矽光子接著劑、PSPI
本課程適合對象：